1109 複合負荷を受けるはんだ接合部の疲労寿命の定量的評価に関する研究(J08-1 電子情報機器,電子デバイスの強度・信頼性評価と熱制御(1) はんだ接合部信頼性,ジョイントセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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Solder joints in the advanced electronic packaging such as 3D packaging are subjected to multi-load consisting of thermal cycling and other mechanical constraints. Since multi-loads may produce ratchet influencing thermal fatigue reliability, a method evaluating thermal fatigue life under multi-loadings should be developed. In this paper, three-point bending tests of the ball grid array (BGA) package were carried out. Experiments were performed with several average stress levels. Number of cycles to failure in experiments decreases as a function of the average stress. FEA qualification was carried out to estimate the fatigue life in three-point bending tests. Error of computational estimated life to the experimental result is big when the average stress is high. It implies that modified Manson-Coffin's law should be used for thermal fatigue life of solder joints under multi-loadings.
2008-08-02