電子デバイスはんだ接合部の熱疲労強度における解析・実験ハイブリッド評価 : 第2報, 機械的疲労試験による評価

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An isothermal mechanical fatigue test method and fatigue testing equipment were developed to investigate the low cycle fatigue strength of Sn-Pb eutectic solder joints. Based upon the results of finite element analysis, it is found that the rate of inelastic strain components (plastic strain and creep strain) in the solder joints can be accurately controlled by the displacement rate of the linearactuator of the test equipment. The isothermal mechanical fatigue tests were carried out by controlling the displacement at a very high displacement rate, and a very low displacement rate, respectively ; only plastic strain was generated in the solder joints at the high displacement rate, and only creep strain at the low rate. It is found that the low cycle fatigue life of Sn-Pb eutectic solder joints is not grealty affected by the ratio of inelastic components. Therefore, it can be said that the low cycle fatigue life can be estimated from the equivalent inelastic strain range, and the relationship of the cycles to failure and the strain range follows Coffin-Manson's law. In comparison of the mechanical fatigue strength results with the results of the cyclic thermal tests, it was found that the mechanical fatigue test method can be used as a good accelerated test method for the thermal fatigue strength of Sn-Pb eutectic solder joints.錫-鉛共晶はんだを対象として，機械的せん断疲労試験を行い熱サイクル温度試験の結果と比較した．解析・実験ハイブリット評価により，機械的試験の加速試験としての有効性を示した．
社団法人日本機械学会の論文
1998-03-25

電子デバイスはんだ接合部の熱疲労強度における解析・実験ハイブリッド評価 : 第2報, 機械的疲労試験による評価

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