BGAはんだ接合部の信頼性における設計因子の影響度評価およびメカニズム解明(J01-1 はんだ接続信頼性,J01 エレクトロニクス実装における熱制御および信頼性評価)

概要

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In recent years, package downsizing has become one of biggest trends in packaging technologies because of miniaturization and the high integration of electronic devices. As a result, the reliability of fatigue life has been prioritized as an important concern. But, the reliability of thermal fatigue life in the solder joint may be lowered by the change of design factors such as the dimensions, shapes, and material properties of package systems. So, the influence of these design factors for the fatigue life should be examined in order to improve the reliability. In this study, the evaluation of influence of various design factors on the reliability of BGA (Ball Grid Array) solder joints was carried out, and got each influence. And, the mechanism influenced in the fatigue life was clarified. With the results, design engineers can rate each factor's effect on reliability and assess the reliability of their design beginning at the concept design stage. Consequently, it will be possible to avoid almost all reliability problems from the beginning. Also, by rating the factors, the design period can be shortened.
一般社団法人日本機械学会の論文
2004-09-04