P59 光学式デジタル画像相関法による鉛フリーはんだの材料特性の特定(薄膜,ポスター講演3)

概要

論文の詳細を見る
The reliability evaluation for the electronic devices mainly depends on FEM analysis. But the measurement of material property spends enormous time and cost. Therefore, the technique of simplicity measuring is strongly requested. In this study, the authors used a digital image correlation method to measure displacement of solder joint and the surrounding materials. By comparing between experimental and analytical displacement results, the material properties of lead-free solder is examined.
一般社団法人日本機械学会の論文
2005-11-03