樹脂-シリコンの微細不完全接合層を考慮したはく離強度評価(<小特集>電子機器の熱・機械信頼性と機械工学)

概要

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This paper presents a fundamental method predicting the interfacial strength between a silicon and a resin with micro scale bonding structure. Scanning electron microscopy (SEM) observation of the interface with the application of mechanical force was carried out. The interface between the silicon and the resin consists of micro-scale bonding structures. Finite Element Analysis was performed to evaluate interfacial strength between the silicon and the resin. Interfacial bonding structures affect the stress singularity field near the edge of interface. By removing elements which satisfy the failure criteria, interfacial strength was evaluated for tensile and three point bending tests. The predicted critical force for the initiation of interfacial crack show good agreement with experimental results.
2009-07-25