4057 自動き裂進展解析によるはんだ接合部の破断寿命評価(G03-13 き裂進展(2),G03 材料力学)

概要

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In recent years, the development of the electronic device using the semiconductor is remarkable. In current advanced technology, it has succeeded in making the package which size is almost equal to the IC chip. Moreover for miniaturization and high integration of the electronic device, it has been fined in soldered joints divisions. However, the strength reliability becomes an important problem, since the thermal fatigue destruction is generated by thermal expansion difference between package and printed circuit board. In the case of chip, not only crack initiation but also crack propagation affects the number of cycles to failure of components. The former can be evaluated on the basis of Manson-Coffin's law. In this study crack path simulation was carried out by using an user subroutine and the number of cycles to failure with crack propagation was evaluated by using Miner's rule concept.
社団法人日本機械学会の論文
2006-09-15