Debris-Free High-Speed Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS

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概要

• 論文の詳細を見る

• We have investigated a novel debris-free high speed laser dicing technology for MEMS. The target were a Tempax or Pyrex glass and silicon and their anodically-bonded multi-layered wafers. Our technology combines three processes: dicing guide fabrication, wafer separation process, and a tape expansion. First process was the internal transformation using a nanosecond Nd:YVO4 laser. The laser pulse width and repetition rate was 11 ns and 20∼100 kHz. The laser scanning speed was over 100 mm/sec. The second process was a mechanical bending separation. The bending stress for glass and Si wafer separation was 10 and 100 MPa, respectively. At the third step, spaces between chips were opened by the tape expansion. The internal transformation fabricated in the first process worked well as the guide of the separation. The diced lines completely followed the internal transformation.

• 社団法人 電気学会の論文
• 2009-03-01

著者

• TANAKA Shuji

  Department of Nanomechanics, Graduate School of Engineering, Tohoku University

• FUJITA Masayuki

  Institute for Laser Technology

• ESASHI Masayoshi

  Department of Nanomechanics, Graduate School of Engineering, Tohoku University

• Tanaka Shuji

  Dep. Of Nanomechanics Tohoku Univ.

• Nakata Yoshiki

  Institute Of Laser Engineering Osaka University

• MIYANAGA Noriaki

  Institute of Laser Engineering, Osaka University

• IZAWA Yusaku

  Institute of Laser Engineering, Osaka University

• TSURUMI Yosuke

  Institute of Laser Engineering, Osaka University

• Esashi Masayoshi

  Dep. Of Nanomechanics Tohoku Univ.

• Esashi Masayoshi

  The World Premier International Res. Center Initiative For Atom Molecule Materials Tohoku Univ.

• Esashi Masayoshi

  Department Of Nanomechanics Tohoku University

• Esashi Masayoshi

  Wpi Research Center Tohoku University

• FUKUSHI Hideyuki

  Department of Nanomechanics, Tohoku University

• SUEDA Keiichi

  Institute of Laser Engineering, Osaka University

• Fukushi Hideyuki

  Department Of Nanomechanics Tohoku University

• Miyanaga Noriaki

  Institute Of Laser Engineering Osaka University

• Miyanaga Noriaki

  Institute Laser Engineering Osaka University

• Sueda Keichi

  Institute Of Laser Engineering Osaka University

• Izawa Yusaku

  Institute Of Laser Engineering Osaka University

• Sueda Keiichi

  Institute Of Laser Engineering Osaka University

• Tsurumi Yosuke

  Institute Of Laser Engineering Osaka University

• Tanaka Shuji

  Department Of Nanomechanics Tohoku University

• Esashi Masayoshi

  Department Of Nanomechanics Graduate School Of Engineering Tohoku University

• Tanaka Shuji

  Department Of Information Electronics Faculty Of Engineering Fukuoka Institute Of Technology

• Tanaka Shuji

  Department Of Electronics Faculty Of Engineering Fukuoka Institute Of Technology

• Tanaka Shuji

  Department of Electronic Materials Engineering, Fukuoka Institute of Technology,

• Fujita Masayuki

  Institiute for Laser Technology, 2-6 Yamadaoka, Suita, Osaka 565-0871, Japan

• TANAKA Shuji

  Department of Chemistry, Faculty of Science, Kyushu University

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