Debris-Free Laser-Assisted Low-Stress Dicing for Multi-Layered MEMS : Separation Method of Glass Layer

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概要

• 論文の詳細を見る

• We have investigated the novel debris-free in-air laser dicing technology for glass. The target wafer was a soda lime glass and a Pyrex glass with the thickness of 1 mm. Our technology combines two processes, which was a dicing guide fabrication and a wafer separation process. First process was the internal transformation using a fundamental wavelength of a Ti:Sapphire laser or a Nd:YAG laser. The pulse width of each laser was 100 fs and 10 ns. The threshold energy for the internal transformation (NA-0.7 focusing) was 3 μJ and 65 μJ, respectively. The second process was a thermally-induced crack propagation using CO2 laser or a mechanical bending separation by pressing a blade. The internal transformation fabricated in first process worked sufficiently as the guide of separation, the dicing line completely followed the internal transformation. The diced cross-section was sharp and free from chipping. In addition, neither debris nor damages were found on the surface after laser dicing.

• 社団法人 電気学会の論文
• 2008-03-01

著者

• TANAKA Shuji

  Department of Nanomechanics, Graduate School of Engineering, Tohoku University

• FUJITA Masayuki

  Institute for Laser Technology

• ESASHI Masayoshi

  Department of Nanomechanics, Graduate School of Engineering, Tohoku University

• KIKUCHI Hideyuki

  Department of Animal Science, Utsunomiya University

• Tanaka Shuji

  Dep. Of Nanomechanics Tohoku Univ.

• Nakata Yoshiki

  Institute Of Laser Engineering Osaka University

• MIYANAGA Noriaki

  Institute of Laser Engineering, Osaka University

• IZAWA Yusaku

  Institute of Laser Engineering, Osaka University

• Kikuchi Hideyuki

  Department Of Nanomechanics Tohoku University

• TSURUMI Yosuke

  Institute of Laser Engineering, Osaka University

• SUEDA Keichi

  Institute of Laser Engineering, Osaka University

• Esashi Masayoshi

  Dep. Of Nanomechanics Tohoku Univ.

• Esashi Masayoshi

  The World Premier International Res. Center Initiative For Atom Molecule Materials Tohoku Univ.

• Esashi Masayoshi

  Department Of Nanomechanics Tohoku University

• Esashi Masayoshi

  Wpi Research Center Tohoku University

• Miyanaga Noriaki

  Institute Of Laser Engineering Osaka University

• Miyanaga Noriaki

  Institute Laser Engineering Osaka University

• Sueda Keichi

  Institute Of Laser Engineering Osaka University

• Izawa Yusaku

  Institute Of Laser Engineering Osaka University

• Tsurumi Yosuke

  Institute Of Laser Engineering Osaka University

• Tanaka Shuji

  Department Of Nanomechanics Tohoku University

• Esashi Masayoshi

  Department Of Nanomechanics Graduate School Of Engineering Tohoku University

• Tanaka Shuji

  Department Of Information Electronics Faculty Of Engineering Fukuoka Institute Of Technology

• Tanaka Shuji

  Department Of Electronics Faculty Of Engineering Fukuoka Institute Of Technology

• Tanaka Shuji

  Department of Electronic Materials Engineering, Fukuoka Institute of Technology,

• Fujita Masayuki

  Institiute for Laser Technology, 2-6 Yamadaoka, Suita, Osaka 565-0871, Japan

• TANAKA Shuji

  Department of Chemistry, Faculty of Science, Kyushu University

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