A new bulk - micromachining using deep RIE and wet etching for an accelerometer

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概要

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• A new bulk silicon micromachining suitable for accelerometer and other micromechanical structures is developed. By combining deep RIE, P ++ diffusion and anisotropic wet etching, surface thin beam structures can be fabricated. This process is applied for small sized and high performance capacitive accelerometer packaged by anodic bonding.

• 社団法人 電気学会の論文
• 1998-09-01

著者

• LIM Geunbae

  Samsung Advanced Institute of Technology

• Esashi Masayoshi

  Department Of Nanomechanics Graduate School Of Engineering Tohoku University

• Baek Seogsoon

  Samsung Advanced Institute Of Technology

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