Development of Cavity Structure for Field Emission on Si Substrate
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概要
- 論文の詳細を見る
A device used for superhigh-speed communications on the terahertz band is required. However, high-speed-response devices fabricated using Si-based technology cannot achieve this frequency. Field emitters have exhibited a high-speed response at frequencies higher than 100 GHz utilizing electron emission in a vacuum. Therefore, field emission devices are very suitable for use as high-speed switching elements. We have fabricated a local vacuum package enclosing a Si field emitter array and a Ti getter on a Si substrate using Si integrated circuit (IC) technology and micro-electro-mechanical system (MEMS) technology for an on-chip integrated device. In this paper, we discuss the Ti getter. The bridge structure getter was successfully evaporated within the cavity structure. This technique can realize micrometer-order alignment, and will be very useful for many applications owing to its high performance.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2007-09-30
著者
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Noda Daiji
Laboratory Of Advanced Science And Technology For Industry University Of Hyogo
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Hatakeyama Masanori
Department Of Viral Oncology Cancer Institute Japanese Foundation For Cancer Research
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Ishida Makoto
Department Of Applied Chemistry & Biochemistry Faculty Of Engineering Kumamoto University
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Sawada Kazuaki
Department Of Electrical And Electronic Engineering Toyohashi University Of Technology
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Ishida Makoto
Department of Electrical and Electronic Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580, Japan
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Nishijyou Kichinosuke
Department of Electrical and Electronic Engineering, Toyohashi University of Technology, Toyohashi, Aichi 441-8580, Japan
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Noda Daiji
Laboratory of Advanced Science and Technology for Industry, University of Hyogo, Kamigori, Hyogo 678-1205, Japan
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Sawada Kazuaki
Department of Electric and Electronic Engineering, Toyohashi University of Technology
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NODA Daiji
Laboratory of Advanced Science & Technology for Industry, University of Hyogo
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