Rapid-Thermal-Processed BaTiO3 Thin Films Deposited by Liquid-Source Misted Chemical Deposition
スポンサーリンク
概要
- 論文の詳細を見る
BaTiO3 thin films deposited on the RuO2(250 nm)/Ru(20 nm)/TiN(200 nm)/Ti(20 nm)/(100)Si substrates by liquid-source misted chemical deposition are reported. The rapid thermal processing (RTP) technique was used for post deposition annealing. It was found that the strain was released and grain size increased for BaTiO3 films treated at high RTP temperature or for long RTP time. The interface between BaTiO3 and the bottom electrode was still sharp for the RTP-treated sample at 950°C. The leakage current density decreases as the RTP temperature increases. It can be decreased to 2.09 nA/cm2 under a supply voltage of 1.5 V. The dielectric constant can be increased up to 250 measured at 100 kHz for the sample treated by RTP at 950°C. The improvements in the BaTiO3 characteristics are due to the fact that RTP can enhance the crystallinity, relax the strain, alleviate the impurities in the films and does not result in significant interdiffusion of the materials.
- INSTITUTE OF PURE AND APPLIED PHYSICSの論文
- 1998-03-15
著者
-
CHAN Shih-Hsiung
National Nano Device Laboratories
-
CHIANG Ming-Chung
National Nano Device Laboratory
-
Sze Simon
National Nano Device Laboratories
-
Horng Ray-hua
Institute Of Precision Egineering National Chung Hsing University
-
Huang Tiao-yuan
National Chiao Tung University
-
Wuu Dong-sing
Institute Of Electrical Engineering Da-yeh University
-
Sze Simon
National Nano Device Laboratory, Hsinchu 300, Taiwan, ROC
-
Wuu Dong-Sing
Institute of Electrical Engineering, Da-Yeh University, Chang-Hwa 515, Taiwan, ROC
-
Huang Tiao-Yuan
National Nano Device Laboratory, Hsinchu 300, Taiwan, ROC
-
Horng Ray-Hua
Institute of Electrical Engineering, Da-Yeh University, Chang-Hwa 515, Taiwan, ROC
関連論文
- Investigation of the Indium Atom Interdiffusion on the Growth of GaN/InGaN Heterostructures
- Improvements of N-Side-up GaN Light-Emitting Diodes Performance by Indium-Tin-Oxide/Al Mirror (Special Issue: Solid State Devices & Materials)
- Improvements in for N-Side-Up GaN/Mirror/Si LEDs Using High Reflective Ohmic Contacts
- Surface Texturing for Wafer-Bonded Vertical-Type GaN/Mirror/Si Light-Emitting Diodes
- Improvement in Extraction Efficiency of GaN-Based Light-Emitting Diodes with Textured Surface Layer by Natural Lithography
- Near-Ultraviolet InGaN/GaN Light-Emitting Diodes Grown on Patterned Sapphire Substrates
- Improvement in GaN-based light-emitting diodes by surface texturization with natural lithography
- GaN/Mirror/Si Light-Emitting Diodes for Vertical Current Injection by Laser Lift-Off and Wafer Bonding Techniques
- Characterization of Large-Area AlGaInP/Mirror/Si Light-Emitting Diodes Fabricated by Wafer Bonding
- High-Power AlGaInP Light-Emitting Diodes with Patterned Copper Substrates by Electroplating
- Ion-Implantation Treatment(Ba, Sr)TiO_3 Thin Films
- Etching Characteristics and Mechanism of Ba_Sr_TiO_3 Thin Films in an Inductively Coupled Plasma
- Thermal Stability of Co-Sputtered Ru-Ti Alloy Electrodes for Dynamic Random Access Memory Applications
- Rapid-Thermal-Processed BaTiO_3 Thin Films Deposited by Liquid-Source Misted Chemical Deposition
- Characterization of Thin-Film Electroluminescent Devices with Multiple Ta_2O_5 Interlayers Incorporated into SrS:Pr,Ce Phosphor
- Impacts of LP-SiN Capping Layer and Lateral Diffusion of interface Trap on Hot Carrier Stress of NMOSFETs
- Application of Field-Induced Source/Drain Schottky Metal-Oxide-Semiconductor to Fin-Like Body Field-Effect Transistor : semiconductors
- The Combined Effects of Nitrogen Implantation at S/D Extension and N_2O Oxide on 0.18μm N- and P-Metal Oxide Field Effect Transistors (MOSEETs)
- Characterization of Antenna Effect by Nondestructive Gate Current Measurement
- Effects of Rapid Thermal Annealing on Si Delta-Doped GaInP Grown by Low Pressure Metalorganic Chemical Vapor Deposition
- Silicon Delta Doping of GaInP Grown by Low-Pressure Metalorganic Chemical Vapor Deposition
- Thinning Technology for Lithium Niobate Wafer by Surface Activated Bonding and Chemical Mechanical Polishing (Special Issue: Solid State Devices & Materials)
- Optical and Electrical Characteristics of CO_2-Laser-Treated Mg-Doped GaN Film
- Electrical Properties of Multiple High-Dose Si Implantation in p-GaN
- Epitaxial Growth of the GaN Film by Remote-Plasma Metalorganic Chemical Vapor Deposition
- The Effects of Low-Pressure Rapid Thermal Post-Annealing on the Properties of (Ba, Sr)TiO_3 Thin Films Deposited by Liquid Source Misted Chemical Deposition : Instrumentation, Measurement, and Fabrication Technology
- Effects of Transparent Conductive Layers on Characteristics of InGaN-Based Green Resonant-Cavity Light-Emitting Diodes
- Low Dielectric Constant Polymer Materials as Bottom Antirefiective Coating Layers for both KrF and ArF Lithography
- Devices Characteristics and Aggravated Negative Bias Temperature Instability in PMOSFETs with Uniaxial Compressive Strain
- High-Brightness Wafer-Bonded Indium-Tin Oxide/Light-Emitting Diode/Mirror/Si
- Wafer-Bonded AlGaInP/Au/AuBe/SiO_2/Si Light-Emitting Diodes
- Etching Characteristics of (Ba, Sr)TiO_3 Thin Films in an Inductively Coupled Plasma
- Breakdown Modes and Their Evolution in Ultrathin Gate Oxide
- Wafer-Bonded 859-nm Vertical-Cavity Surface-Emitting Lasers on Si Substrate with Metal Mirror
- Near-Ultraviolet InGaN/GaN Light-Emitting Diodes Grown on Patterned Sapphire Substrates
- Characterization of Large-Area AlGaInP/Mirror/Si Light-Emitting Diodes Fabricated by Wafer Bonding
- Thinning Technology for Lithium Niobate Wafer by Surface Activated Bonding and Chemical Mechanical Polishing
- Effects of Transparent Conductive Layers on Characteristics of InGaN-Based Green Resonant-Cavity Light-Emitting Diodes
- High-Power AlGaInP Light-Emitting Diodes with Patterned Copper Substrates by Electroplating
- Improvement in Extraction Efficiency of GaN-Based Light-Emitting Diodes with Textured Surface Layer by Natural Lithography
- Surface Texturing for Wafer-Bonded Vertical-Type GaN/Mirror/Si Light-Emitting Diodes
- Fabrications of Si Thin-Film Solar Cells by Hot-Wire Chemical Vapor Deposition and Laser Doping Techniques
- Improvements of N-Side-up GaN Light-Emitting Diodes Performance by Indium–Tin-Oxide/Al Mirror
- GaN-Based Green Resonant Cavity Light-Emitting Diodes
- High-Brightness Wafer-Bonded Indium-Tin Oxide/Light-Emitting Diode/Mirror/Si
- Characteristics of Flip-Chip InGaN-Based Light-Emitting Diodes on Patterned Sapphire Substrates
- High-Performance AlGaInP/GaAs Light-Emitting Diodes with a Carbon-Doped GaP/Indium–Tin Oxide Contact Layer
- Growth and Characterization of Epitaxial ZnO Nanowall Networks Using Metal Organic Chemical Vapor Deposition
- GaN/Mirror/Si Light-Emitting Diodes for Vertical Current Injection by Laser Lift-Off and Wafer Bonding Techniques
- Rapid-Thermal-Processed BaTiO3 Thin Films Deposited by Liquid-Source Misted Chemical Deposition