Horng Ray-hua | Institute Of Precision Egineering National Chung Hsing University
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概要
関連著者
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Horng Ray-hua
Institute Of Precision Egineering National Chung Hsing University
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Horng Ray-Hua
Institute of Electrical Engineering, Da-Yeh University, Chang-Hwa 515, Taiwan, ROC
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HORNG Ray-Hua
Institute of Precision Engineering, National Chung Hsing University
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Wuu Dong-Sing
Department of Electrical Engineering, Da-Yeh University
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HUANG Shao-Hua
Department of Materials Engineering, National Chung Hsing University
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WUU Dong-Sing
Department of Materials Engineering, National Chung Hsing University
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Lee Chia-en
Department Of Electrical Engineering National Chung Hsing University
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Horng R‐h
National Chung Hsing Univ. Taichung Twn
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Wuu D‐s
National Chung Hsing Univ. Taichung Twn
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Wuu Dong-sing
Institute Of Electrical Engineering Da-yeh University
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WUU Dong-Sing
Institute of Electrical Engineering, Da-Yeh University
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Lin Wen-yu
Department Of Materials Engineering National Chung Hsing University
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Hsu Shun-cheng
Department Of Materials Engineering National Chung Hsing University
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Sze Simon
National Nano Device Laboratories
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Horng Ray-hua
Institute Of Precision Engineering National Chung Hsing University
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Huang Shih-yung
Department Of Materials Engineering National Chung Hsing University
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Wang Wei-kai
Department Of Materials Engineering National Chung Hsing University
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Sze S‐m
National Nano Device Lab. Hsinchu Twn
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Huang T‐y
National Chiao Tung Univ. Hsinchu Twn
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CHAN Shih-Hsiung
National Nano Device Laboratories
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LEE Ming-Kwei
Department of Electrical Engineering, National Sun Yat-sen University
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SZE Simon
National Nano Device Laboratory
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LEE Ming-Kwei
Institute of Electrical Engineering, National Sun Yat-Sen University
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HUANG Tiao-Yuan
National Nano Device Laboratory
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Kung C‐y
National Chung Hsing Univ. Taichung Twn
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Kung Chung-yuan
Department Of Electrical Engineering National Chung Hsing University
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Sze S
National Chiao‐tung Univ. Hsinchu Twn
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Huang T-y
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tung University
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Huang Tiao-yuan
Institute Of Electronics National Chiao Tung University:national Nano Device Laboratories
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Sze Simon
Department Of Electronics Engineering And Institute Of Electronics National Chiao-tung University:na
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Sze Simon-m.
National Nano Device Laboratory
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Lee M‐k
National Sun Yat‐sen Univ. Kaohsiung Twn
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Sze S
National Nano Device Lab. Hsin‐chu Twn
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TSENG Chung-Yang
Visual Photonics Epitaxy Company
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HUANG Man-Fang
Visual Photonics Epitaxy Company
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Lin Po-rung
Department Of Materials Engineering National Chung Hsing University
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Yu Ting-en
Department Of Materials Engineering National Chung Hsing University
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Wuu Dong-sing
Department Of Materials Engineering National Chung Hsing University
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Huang Tiao-yuan
National Chiao Tung University
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Wu Chia-cheng
Department Of Materials Engineering National Chung Hsing University
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Wuu Dong-Sing
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Leu C‐c
National Nano Device Lab. Hsin‐chu Twn
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Chan S‐h
Advanced Epitaxy Technol. Inc. Hsinchu Twn
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Chan Shih-hsiung
Department Of Electrical Engineering National Cheng Kung University
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HUANG Shao-Hua
Dept. Materials Engineering, National Chung Hsing University
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WUU Dong-Sing
Dept. Materials Engineering, National Chung Hsing University
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PAN Kuan-Fu
Institute of Precision Engineering, National Chung Hsing University
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HSU Shun-Cheng
Department of Materials Engineering, National Chung Hsing University
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CHEN Tsung-Yu
R&D Department, Advanced Epitaxy Technology Inc.
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YANG Chiao-Chih
Institute of Precision Engineering, National Chung Hsing University
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LIN Wen-Yu
Department of Materials Engineering, National Chung Hsing University
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SHIH Wen-Chung
Institute of Electro-Optical & Material Science, National Formosa University
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FANG Jau-Shing
Institute of Electro-Optical & Material Science, National Formosa University
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HSU Ta-Cheng
Epistar Corporation
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HUO Tai-Chan
Epistar Corporation
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JOU Ming-Jiunn
Epistar Corporation
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LIN Aikey
Wafer Works Corporation
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YU Yuan-Hsin
Wafer Works Corporation
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JIANG Yann-Zyh
Institute of Precision Engineering, National Chung Hsing University
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KUNG Chung-Yuan
Department of Electrical Engineering, National Chung Hsing University
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KUNG Chung-Yuan
Institute of Precision Engineering, National Chung Hsing University
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LEU Ching-Chich
National Nano Device Laboratory
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KUO Nei-Hao
Institute of Electrical Engineering, Da-Yeh University
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CHIANG Ming-Chung
National Nano Device Laboratory
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Pan Kuan-fu
Institute Of Precision Engineering National Chung Hsing University
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Wang Woei-kai
Department Of Materials Engineering National Chung Hsing University
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Yang Chiao-chih
Institute Of Precision Engineering National Chung Hsing University
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Peng Wei-chih
Institute Of Electrical Engineering Da-yeh University
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Seieh Chi-hua
Visual Photonics Epitaxy Company
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Han Pin
Institute Of Precision Engineering National Chung Hsing University
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Kuo Nei-hao
Institute Of Electrical Engineering Da-yeh University
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Wuu Dong-sing
Dept. Materials Engineering National Chung Hsing University
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TSAI Shi-Jen
Visual Photonics Epitaxy Company
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LIU Jin-Shiarng
Visual Photonics Epitaxy Company
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Huang M‐f
Chang Gung Univ. Taoyuan Twn
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Lien Yi-chung
Institute Of Electrical Engineering Da-yeh University
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Huang Shao-hua
Dept. Materials Engineering National Chung Hsing University
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Chen Tsai-ning
Department Of Materials Engineering National Chung Hsing University
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Liao Fang-ching
Institute Of Electrical Engineering Da-yeh University
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Leu Ching-chich
National Nano Device Laboratories
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Wu Chia-Cheng
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Wang Wei-Kai
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Wuu Dong-Sing
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Huang Man-Fang
Visual Photonics Epitaxy Co., Ltd.
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HAN Pin
Institute of Precision Engineering, National Chung Hsing University
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Wang Wei‐kai
National Chung Hsing Univ. Taichung Twn
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SU Ying-Yong
Institute of Precision Engineering, National Chung Hsing University
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WANG Woei-Kai
Department of Materials Engineering, National Chung Hsing University
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HSU Shun-Chen
Department of Materials Engineering, National Chung Hsing University
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WU Chia-Cheng
Department of Materials Engineering, National Chung Hsing University
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LIN Chin-Ching
Institute of Precision Engineering, National Chung Hsing University
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HAUNG Tiao-Yuan
National Nano Device Laboratory
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LIAO Fang-Ching
Institute of Electrical Engineering, Da-Yeh University
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WU Luh-Huei
Institute of electrical engineering, Da-Yeh University
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HORNG Ray-Hua
National Nano Device Laboratory
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Su Ying-yong
Institute Of Precision Engineering National Chung Hsing University
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Fang Jau-shing
Institute Of Electro-optical & Material Science National Formosa University
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Wu Long-hai
Department Of Applied Chemistry National Chiao Tung University
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WEI Sun-Chin
Institute of Microelectronics & Department of Electrical Engineering, National Cheng Kung University
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Wu Luh-huei
Department Of Applied Chemistry National Chiao Tung University
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Wei S‐c
Key Laboratory Of Semiconductor Lasers Changchun University Of Science And Technology
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Liu P‐h
Trw Electronics And Technol. Div. Ca Usa
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Wei Sun-chin
Institute Of Electrical Engineering Da-yeh University
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HUANG Shih-Yung
Department of Materials Engineering, National Chung Hsing University
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WANG Wei-Kai
Department of Materials Engineering, National Chung Hsing University
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YU Ting-En
Department of Materials Engineering, National Chung Hsing University
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LIN Po-Rung
Department of Materials Engineering, National Chung Hsing University
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Yu Ting‐en
National Chung Hsing Univ. Taichung Twn
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Lin Po‐rung
National Chung Hsing Univ. Taichung Twn
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LIEN Yi-Chung
Institute of Electrical Engineering, Da-Yeh University
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TSENG Chung-Yang
Institute of Electrical Engineering, Da-Yeh University
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CHANG Kuo-Hsiung
Visual Photonics Epitaxy Company
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LIU Pin-Hui
Visual Photonics Epitaxy Company
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LIN Kun-Chuan
Visual Photonics Epitaxy Company
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LIAU Fang-Ching
Institute of Electrical Engineering, Da-Yeh University
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Juang Fuh-shyang
Institute Of Electro-optical And Materials Science National Formosa University
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Wuu Doug-sing
Department Of Materials Engineering National Chung Hsing University
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Lai Hsin-yi
Department Of Mechanical Engineering National Cheng-kung University
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Hsu Shun-chen
Department Of Materials Engineering National Chung Hsing University
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Tseng Chung-yang
Institute Of Electrical Engineering Da-yeh University
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Yang Chiao-Chih
Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, R.O.C.
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Wu Bing-Rui
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, Republic of China
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Chen Tsung-Yu
R&D Department, Advanced Epitaxy Technology Inc., Hsinchu Industrial Park, Taiwan 303, R.O.C
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Ting Chia-Jen
Mechanical Industry Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
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Ho Shih-Shian
Mechanical Industry Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
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Tsai Hung-Yin
Mechanical Industry Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan 310, R.O.C.
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Lai Hsin-Yi
Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan 701, R.O.C.
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Kung Chung-Yuan
Department of Electrical Engineering, National Chung Hsing University, Taichung 402, Taiwan, R. O. C.
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Mao Hsin-Yuan
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, Republic of China
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Yu Ting-En
Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Yu Ting-En
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Ting Chia-Jen
Mechanical and Systems Research Laboratories, Industrial Technology Research Institute, Taiwan 310, R.O.C.
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Lin Wen-Yu
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Wuu Dong-Sing
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, R.O.C.
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Wuu Dong-Sing
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C
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Wuu Dong-Sing
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, R. O. C.
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Wuu Dong-Sing
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, Republic of China
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Lien Shui-Yang
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, Republic of China
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Lin Yen-Chia
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, Republic of China
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Hseih In-Cha
Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, Republic of China
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Wuu Dong-Sing
Department of Materials Science and Engineering, National Chung Hsing University, Taichung 40227, Taiwan, Republic of China
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Peng Wei-Chih
Institute of Electrical Engineering, Da-Yeh University, Chang-Hwa 515, Taiwan
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Chen Tsai-Ning
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Chen Tsai-Ning
Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Pan Kuan-Fu
Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, R.O.C.
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Wang Woei-Kai
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Lin Shu-Hei
Institute of Electro-optical and Materials Science, National Formosa University, Huwei, Taiwan 632, Republic of China
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Su Ying-Yong
Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, R.O.C.
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Huang Man-Fang
Visual Photonics Epitaxy Company, Taoyuan 325, Taiwan
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Tsai Shi-Jen
Visual Photonics Epitaxy Company, Taoyuan 325, Taiwan
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Jiang Yann-Zyh
Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan 402, ROC.
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, R. O. C.
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan 402, ROC.
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan, Republic of China
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Horng Ray-Hua
Institute of Precision Engineering, National Chung Hsing University, Taichung 40227, Taiwan, Republic of China
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Su Juh-Yuh
Ubilux Optoelectronics Corporation, Tainan Science-Based Industrial Park, Tainan 74145, Taiwan, Republic of China
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Zheng Xinhe
Department of Materials Science and Engineering, National Chung Hsing University, Taichung 40227, Taiwan, Republic of China
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Shih Wen-Chung
Institute of Electro-Optical & Material Science, National Formosa University, Huwei, Taiwan 632, Republic of China
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Huang Shao-Hua
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C
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Huang Shao-Hua
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, R. O. C.
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Huang Shao-Hua
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, ROC.
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Huang Shao-Hua
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Yu Yuan-Hsin
Wafer Works Corporation, Taoyuan, Taiwan 326, Republic of China
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Seieh Chi-Hua
Visual Photonics Epitaxy Company, Taoyuan 325, Taiwan
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Lin Po-Rung
Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Lin Po-Rung
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Hsu Shun-Cheng
Department of Materials Science and Engineering, National Chung Hsing University, Taichung 40227, Taiwan, Republic of China
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Huang Shih-Yung
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Huo Tai-Chan
Epistar Corporation, Hsinchu, Taiwan 300, Republic of China
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Lien Yi-Chung
Institute of Electrical Engineering, Da-Yeh University, Chang-Hwa 515, Taiwan
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Juang Fuh-Shyang
Institute of Electro-Optics and Materials Engineering, National Formosa University, Huwei, Taiwan 632, Republic of China
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Juang Fuh-Shyang
Institute of Electo-optical and Materials Science, National Formosa University, 64 Wunhua Road, Huwei, Yunlin 632-08, Taiwan
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Lee Chia-En
Department of Materials Engineering, National Chung Hsing University, Taichung 402, Taiwan, R.O.C.
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Lee Chia-En
Department of Materials Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Lee Chia-En
Department of Electrical Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Wu Chia-Cheng
Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan 402, R.O.C.
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Fang Jau-Shing
Institute of Electro-Optical & Material Science, National Formosa University, Huwei, Taiwan 632, Republic of China
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Han Pin
Institute of Precision Engineering, National Chung Hsing University, Taichung, Taiwan 402, Republic of China
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Horng Ray-Hua
National Chung Hsing University, Taichung 402, Taiwan
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Sze Simon
National Nano Device Laboratory, Hsinchu 300, Taiwan, ROC
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Wuu Dong-Sing
Institute of Electrical Engineering, Da-Yeh University, Chang-Hwa 515, Taiwan, ROC
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Huang Tiao-Yuan
National Nano Device Laboratory, Hsinchu 300, Taiwan, ROC
著作論文
- Improvements of N-Side-up GaN Light-Emitting Diodes Performance by Indium-Tin-Oxide/Al Mirror (Special Issue: Solid State Devices & Materials)
- Improvements in for N-Side-Up GaN/Mirror/Si LEDs Using High Reflective Ohmic Contacts
- Surface Texturing for Wafer-Bonded Vertical-Type GaN/Mirror/Si Light-Emitting Diodes
- Improvement in Extraction Efficiency of GaN-Based Light-Emitting Diodes with Textured Surface Layer by Natural Lithography
- Near-Ultraviolet InGaN/GaN Light-Emitting Diodes Grown on Patterned Sapphire Substrates
- Improvement in GaN-based light-emitting diodes by surface texturization with natural lithography
- GaN/Mirror/Si Light-Emitting Diodes for Vertical Current Injection by Laser Lift-Off and Wafer Bonding Techniques
- Characterization of Large-Area AlGaInP/Mirror/Si Light-Emitting Diodes Fabricated by Wafer Bonding
- High-Power AlGaInP Light-Emitting Diodes with Patterned Copper Substrates by Electroplating
- Ion-Implantation Treatment(Ba, Sr)TiO_3 Thin Films
- Etching Characteristics and Mechanism of Ba_Sr_TiO_3 Thin Films in an Inductively Coupled Plasma
- Thermal Stability of Co-Sputtered Ru-Ti Alloy Electrodes for Dynamic Random Access Memory Applications
- Rapid-Thermal-Processed BaTiO_3 Thin Films Deposited by Liquid-Source Misted Chemical Deposition
- Characterization of Thin-Film Electroluminescent Devices with Multiple Ta_2O_5 Interlayers Incorporated into SrS:Pr,Ce Phosphor
- Thinning Technology for Lithium Niobate Wafer by Surface Activated Bonding and Chemical Mechanical Polishing (Special Issue: Solid State Devices & Materials)
- Effects of Transparent Conductive Layers on Characteristics of InGaN-Based Green Resonant-Cavity Light-Emitting Diodes
- High-Brightness Wafer-Bonded Indium-Tin Oxide/Light-Emitting Diode/Mirror/Si
- Wafer-Bonded AlGaInP/Au/AuBe/SiO_2/Si Light-Emitting Diodes
- Etching Characteristics of (Ba, Sr)TiO_3 Thin Films in an Inductively Coupled Plasma
- Wafer-Bonded 859-nm Vertical-Cavity Surface-Emitting Lasers on Si Substrate with Metal Mirror
- Near-Ultraviolet InGaN/GaN Light-Emitting Diodes Grown on Patterned Sapphire Substrates
- Characterization of Large-Area AlGaInP/Mirror/Si Light-Emitting Diodes Fabricated by Wafer Bonding
- Thinning Technology for Lithium Niobate Wafer by Surface Activated Bonding and Chemical Mechanical Polishing
- Effects of Transparent Conductive Layers on Characteristics of InGaN-Based Green Resonant-Cavity Light-Emitting Diodes
- High-Power AlGaInP Light-Emitting Diodes with Patterned Copper Substrates by Electroplating
- Improvement in Extraction Efficiency of GaN-Based Light-Emitting Diodes with Textured Surface Layer by Natural Lithography
- Surface Texturing for Wafer-Bonded Vertical-Type GaN/Mirror/Si Light-Emitting Diodes
- Fabrications of Si Thin-Film Solar Cells by Hot-Wire Chemical Vapor Deposition and Laser Doping Techniques
- Improvements of N-Side-up GaN Light-Emitting Diodes Performance by Indium–Tin-Oxide/Al Mirror
- GaN-Based Green Resonant Cavity Light-Emitting Diodes
- High-Brightness Wafer-Bonded Indium-Tin Oxide/Light-Emitting Diode/Mirror/Si
- Characteristics of Flip-Chip InGaN-Based Light-Emitting Diodes on Patterned Sapphire Substrates
- High-Performance AlGaInP/GaAs Light-Emitting Diodes with a Carbon-Doped GaP/Indium–Tin Oxide Contact Layer
- Growth and Characterization of Epitaxial ZnO Nanowall Networks Using Metal Organic Chemical Vapor Deposition
- GaN/Mirror/Si Light-Emitting Diodes for Vertical Current Injection by Laser Lift-Off and Wafer Bonding Techniques
- Rapid-Thermal-Processed BaTiO3 Thin Films Deposited by Liquid-Source Misted Chemical Deposition