加工環境コントロール型CMP装置によるガラス基板の研磨特性

概要

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Aiming to achieve highly effective polishing in the super-precision polishing of the glass substrate using for HDD,we have conducted a research examining polishing characteristics of the glass substrate cerium oxide and manganese oxide slurries, and a newly devised atmosphere control sealed CMP machine (Bell-jar shaped CMP chamber). Polishing experiment was carried in a radical environment by making the polishing chamber vacuum, or highly pressurized charging various gases inside. Polishing rates varied as the polishing environment varied. When compared with the conventional CMP, the polishing rate increased from 1.5 to 2.0 times. The above result suggests the effectiveness of the glass polishing in the pressurized chamber utilizing the atmosphere control sealed CMP machine. Furthermore this allows the polishing time shortened, leading to the reduction of slurry consumption.