パッド表面を基準面とするドレッシング技術の開発 : —フレキシブルファイバードレッサーとドレッシング均一性評価の開発—

概要

論文の詳細を見る
As a surface reference conditioner, original flexible fiber conditioner was developed to realize uniform pad conditioning in CMP (Chemical Mechanical Polishing). The developed conditioner is composed of a lot of bundles of fine metal fibers to contact pad surface independently. Constant conditioning force can be applied to pad surface with fiber edges regardless of long range of height variation of pad surface. In fact, the developed conditioner made pad surface to be roughened with conforming to a protruding area of 50um on pad surface. Furthermore, an original evaluation on conditioning uniformity was demonstrated quantitatively by making use of relationship between in-depth color variation and pad conditioning depth using dyed pad. As the result, the developed pad conditioning was more uniform entirely across a pad than traditional disk type conditioner. The performance resulted in both contraction of pad break-in process and improvement of removal rate uniformity within wafer in the course of pad break-in process.