パッド表面分析による研磨メカニズムの研究(第1報) : FT-IRおよびラマン散乱分光分析による立ち上げパッド表面状態の解析

概要

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The surface was evaluated qualitatively on a break-in pad in CMP (Chemical Mechanical Polishing). In particular, chemical structure of polyurethane, which is a material of polishing pad, was focused on the evaluation. According to the surface analysis by FT-IR under dry condition, as the pad break-in process was proceeding, soft segments of polyurethane were rich on the pad surface. According to the surface analysis by Raman scattering spectroscopy under wet condition, it was suggested that adsorption water exists on the surface of break-in pad. The permeation depth of the adsorption water was estimated around 10um from pad surface. From the result of the transition process from wet condition to dehydration condition, hard segments of polyurethane segregated on the surface of pad combines with the internal hard segments or adsorption water. As the result, it was speculated that the soft segment was remained on the pad surface.
社団法人精密工学会の論文
2007-09-05