加工雰囲気を制御したベルジャー型ポリシング(CAP)装置とそのCMP特性

概要

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Focusing on the atmospheres around the processing unit, a new CMP machine is developed with a prototype featuring a bell-jar shaped chamber that hermetically contains the entire processing unit. The machine is named "Bell-Jar Type Controlled Atmosphere Polisher" or "CAP" in short. Polishing characteristics of Cu films, silicon and silicon oxide are studied using the CAP under vacuum, or under the pressurized conditions by injecting various gases such as air, oxygen, nitrogen or argon (either individually or in combination) into the bell-jar. Under both vacuum and pressurized conditions, polishing rates of silicon and silicon oxide are 2.5 times higher than those under the conventional polishing that is processed under the atmospheric pressure. Polishing rates of Cu that is easily oxidizable increase under the oxygen gas ambient while it decrease when inert gases are injected. Polishing characteristics vary significantly depending on the types of gases injected into the bell-jar and their pressures as well as chemical properties of the works to be processed. The results confirm the polishing mechanisms that have remained suppositional until now.
社団法人精密工学会の論文
2004-05-05