OS2402 三次元積層半導体チップにおけるマイクロバンプの非弾性応力シミュレーション(OS24-1 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性,OS-24 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性)

概要

論文の詳細を見る
In this study, FEM simulation for micro-bump with and without under fill was performed to understand singular stress field around triple junction and effects of under fill resin on its stress field. Micro-bump was constructed by 20 copper grains which had anisotropic crystal orientation. Values of parameter on singular stress field (λ and K) and area size of singular stress field were estimated up to nominal strain of 1 % and it was shown that under fill resin played an important role for singular stress field at triple junction of micro-bump.
一般社団法人日本機械学会の論文
2011-07-16