OS2401 次世代半導体チップにおける微細構造領域の熱伝導特性と力学的変形特性(OS24-1 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性,OS-24 三次元積層半導体チップにおけるシリコン貫通ビア/微細金属接合技術と強度信頼性)

概要

論文の詳細を見る
In this study, equivalent material properties of thermal conductivity, Young's modulus, Shear modulus and Poisson's ratio for through silicon via (TSV) layer and micro bump layer were estimated by FEM simulation. These equivalent material properties showed anisotropy depend on the fine structure of materials in TSV layer and micro bump layer. Response surface of these equivalent material properties were made by using plan of experiment method. Equivalent material properties that are difficult to be derived by the mixing rule can be efficiently derived by using the response surface.
一般社団法人日本機械学会の論文
2011-07-16