Integrated Tungsten Chemical Mechanical Polishing Process Characterization for Via Plug Interconnection in Ultralarge Scale Integrated Circuits
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2002-08-15
著者
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Wang Chin-kun
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tang University
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CHENG Huang-Chung
Department of Electronics Engineering and Institute of Electronics, National Chiao Tung University
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Cheng Huang-chung
Department Of Electronics Engineering And Institute Of Electronics National Chiao Tang University
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WU Hua-Shu
Taiwan Semiconductor Manufacturing Company Ltd.
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OU Nai-Tien
Taiwan Semiconductor Manufacturing Company Ltd.
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