Plasma Copolymerization of C6F6/C5F8 for Application of Low-Dielectric-Constant Fluorinated Amorphous Carbon Films and Its Gas-Phase Diagnostics Using In Situ Fourier Transform Infrared Spectroscopy

概要

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Low-dielectric-constant fluorinated amorphous carbon films have been prepared from a C6F6 and C5F8 gas mixture by an inductively coupled plasma-enhanced chemical vapor deposition method. The films from 100% C5F8 have volatile nature, and they are vaporized by heating to 400°C. On the other hand, the films prepared with 100% C6F6 have higher thermal stability. After the thermal treatment of the composite films, the dielectric constant of the films is reduced to 1.6, although the residual thickness of the films is not 100%. This result suggests that the tissue from C5F8 is vaporized by thermal treatment and voids are formed in the films. Void concentration in the films is estimated to be 40–60%. The structural change due to the thermal treatment stops after 5–10 min, and no marked structural changes are observed after further thermal treatment at 400°C. The higher thermal stability of the films prepared with C6F6 has been attributed to the incorporation of the aromatic ring structure in the films. The gas-phase diagnostics of the deposition processes and the structural analysis of the films have suggested that C6F6 is highly polymerizable and its ring structure can be incorporated in the films.
Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
2004-05-15