Assessing Aptitude of Plated Ni–W Film as Mold Materials for Borosilicate Glass

概要

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We propose the Ni–W plating film as a mold material for the hot embossing of borosilicate glass. The lifetime of a Ni–W plating mold is important from a practical perspective. However, there have been no previous reports on the life of a mold. Contact angle has been reported as a parameter for the comparative assessment of wettability. In this report, we identified the components of borosilicate glass reacted with a Ni–W film by elemental analysis together with a wettability test. In the wettability test, increasing temperature caused a decrease in of contact angle, which is caused by the chemical reaction at the center of glass. In the results of the elemental analysis of the Ni–W film in contact with glass, Zn, a constituent of the glass, was not detected in the noncontact zone, but was detected in the contact zone. There is no binary alloy phase diagram of W–Zn. It is considered that W does not form an alloy with Zn. Results from the reaction of Zn on Ni indicated an increase in the wettability of borosilicate glass for the Ni–W plating film.
2009-06-25