Microstructuring of 45-μm-Deep Dual Damascene Openings in SU-8/Si by UV-Assisted Thermal Imprinting with Opaque Mold
スポンサーリンク
概要
- 論文の詳細を見る
In this study, we demonstrated a process for fabricating a dual damascene opening in a chemically amplified negative UV photoresist, such as SU-8. The process is based on a UV-assisted thermal-imprinting process, which involved UV pretreatment and thermal imprinting using a Ni mold. After establishing process parameters (e.g., adhesion enhancing, UV pre-treating, thermal imprinting, and etch back conditions) for the given geometry and dimensions of the mold pattern, we could successfully form 25-μm-deep trenches with a 10 μm line-and-space pattern and 45 μm-deep via holes in SU-8/Si samples by UV-assisted thermal imprinting, followed by O2/CHF3 reactive ion etching (RIE). Delamination defects could be avoided with the help of adhesion enhancement treatment. The process studied here showed great potential in reducing time and cost compared with the standard photolithographic dual damascene process.
- 2009-06-25
著者
-
Maeda Ryutaro
Advanced Manufacturing Research Institute National Institute Of Advanced Industrial Science And Tech
-
Takahashi Masaharu
Advanced Manufacturing Research Institute National Institute Of Advanced Industrial Science And Tech
-
Youn Sung-Won
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
-
Ueno Akihisa
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
-
Maeda Ryutaro
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
-
Takahashi Masaharu
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
関連論文
- P-MNS-07 NANOTRANSFER METHOD FOR THE FERROELECTRIC FILMS ONTO THE POLYMER SUBSTRATE(Micro/Nanosystem Science and Technology,Technical Program of Poster Session)
- High-k dielectrics for application in broadband radio frequency-microelectromechanical system capacitive shunt switch (特集 強誘電体のセンサ・マイクロマシン応用)
- Characterization and Permeation of Microfabricated Palladium Membrane
- Microstructuring of 45-μm-Deep Dual Damascene Openings in SU-8/Si by UV-Assisted Thermal Imprinting with Opaque Mold
- Nanoimprint of Glass Materials with Glassy Carbon Molds Fabricated by Focused-Ion-Beam Etching
- Electrostatic Imprint Process for Glass
- Micro Press Molding of Borosilicate Glass Using Plated Ni–W Molds
- Size Dependence of Quick Cavity Filling Behavior in Ultraviolet Nanoimprint Lithography Using Pentafluoropropane Gas
- Flexible polyimide micropump fabricated using hot embossing (Special issue: Microprocesses and nanotechnology)
- Assessing Aptitude of Plated Ni–W Film as Mold Materials for Borosilicate Glass
- Microstructuring of Dual Damascene Opening by Hot Embossing Combined with Etch-Back Process
- Ultrasonic Nanoimprint on Poly(ethylene terephthalate) at Room Temperature
- Development of Ni–P-Plated Inconel Alloy Mold for Imprinting on Pyrex Glass
- Fabrication of Glassy Carbon Molds Using Hydrogen Silsequioxane Patterned by Electron Beam Lithography as O2 Dry Etching Mask
- Control of Parameters Influencing the Thermal Imprint of Parylene/Silicon
- Nanoimprint Lithography Combined with Ultrasonic Vibration on Polycarbonate
- Preparation and Photovoltaic Properties of Lead Lanthanum Zirconate Titanate in Design of Multilayers
- Photovoltaic Effect of Crystalline-Oriented Lead Lanthanum Zirconate Titanate in Layered Film Structure
- Ultrasonic Nanoimprinting in Organic Spin-on-Glass-Coated Si Substrates