Control of Parameters Influencing the Thermal Imprint of Parylene/Silicon
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概要
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The study aims to investigate the possible defects that may occur during imprinting of poly(chloro-$ p$-xylylene) (parylene-C) film (thermal oxidation, delamination, thermal cracking and insufficient filling at the periphery) and to overcome them by modifying the process conditions and mold design. X-ray diffraction (XRD) analyses results for the parylene-C films indicated that higher deposition pressure leads to a lower crystallinity of parylene-C film. By tuning the process conditions and mold design, patterned fields (composed of arrays of 25-μm-high, 10-μm-wide and 1-mm-long lines with 10 μm spacing) in 0.4-mm-thick and 20-mm-sized nickel molds could be successfully replicated on 60-μm-thick parylene-C films deposited at both 25 and 45 mTorr. Complete filling over the whole imprint area could be achieved at ${<}270$ °C with the press force at 2 kN and the press hold time of 900 s with the aid of an implemented dummy pattern. Both thermal cracking and delamination could be avoided, even at 270 °C, under the established process conditions and mold design with the help of an adhesion promotion treatment of silicon substrates (SF6 plasma etching for 2 min and spin-coating of KBM-503-based solution). Furthermore, the molds used for paryelne imprinting could be cleaned by dipping in chloronaphthalene solution at ${>}175$ °C, followed by an oxygen plasma etching.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2007-09-30
著者
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Maeda Ryutaro
Advanced Manufacturing Research Institute National Institute Of Advanced Industrial Science And Tech
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Takahashi Masaharu
Advanced Manufacturing Research Institute National Institute Of Advanced Industrial Science And Tech
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Youn Sung-Won
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
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Goto Hiroshi
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
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Oyama Shoji
Design Engineering Group, Engineering Department, Hirose Sensing Technology (HST) Co., Ltd., Kaneko No. 2 Building 8F, 2-6-23 Shinyokohama, Kohoku-ku, Yokohama 222-0033, Japan
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Maeda Ryutaro
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
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Takahashi Masaharu
Advanced Manufacturing Research Institute (AMRI), National Institute of Advanced Industrial Science and Technology (AIST), 1-2-1 Namiki, Tsukuba, Ibaraki 305-8564, Japan
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