Characterization and Analyses of Interface Structures in Directly Bonded Si(011)/Si(001) Substrates

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概要

• 論文の詳細を見る

• We investigated the interface structure of directly bonded Si(011)/Si(001) substrates prepared by conventional bonding and grind-back. The interfacial structure was analyzed by transmission electron microscopy (TEM) and in-plane X-ray diffraction (XRD). The plan-view and cross-sectional TEM observations provided evidence that screw dislocation lines were localized to the interfacial plane and that threading dislocations were absent. Grazing-incidence in-plane XRD analyses confirmed the existence of mosaic structures at the interface. These structures were formed because of the deformation field produced by the screw dislocations. This allowed a high level of crystallinity to be maintained in regions away from the interface in both the Si(011) layer and the Si(001) wafer.

• 2009-02-25

著者

• SAKAI Akira

  Graduate School of Engineering, Nagoya University

• Zaima Shigeaki

  Graduate School Of Eng. Nagoya Univ.

• Nakatsuka Osamu

  Graduate School Of Engineering Nagoya University

• Izunome Koji

  Covalent Materials Corporation, 6-861-5 Higashi-ko, Seiro, Kitakanbara, Niigata 957-0197, Japan

• Isogai Hiromichi

  Covalent Materials Corporation, Seiro, Niigata 957-0197, Japan

• Toyoda Eiji

  Covalent Silicon Co., Ltd., Seiro, Niigata 957-0197, Japan

• Senda Takeshi

  Covalent Materials Corporation, Seiro, Niigata 957-0197, Japan

• Omote Kazuhiko

  Rigaku Corp., Akishima, Tokyo 196-8666, Japan

• Nakatsuka Osamu

  Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan

• Nakatsuka Osamu

  Graduate School of Eng., Nagoya Univ.

• Zaima Shigeaki

  Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan

• Toyoda Eiji

  Covalent Materials Corporation, Seiro, Niigata 957-0197, Japan

• Sakai Akira

  Graduate School of Engineering Science, Osaka University, 1-3 Machikaneyama-cho, Toyonaka, Osaka 560-8531, Japan

• Sakai Akira

  Graduate School of Engineering Science, Osaka University, 1-3 Machikane-cho, Toyonaka, Osaka 560-8531, Japan

• Senda Takeshi

  Covalent Materials Corporation, 6-861-5 Higashi-ko, Seiro, Kitakanbara, Niigata 957-0197, Japan

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