Nakatsuka Osamu | Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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概要
- Nakatsuka Osamuの詳細を見る
- 同名の論文著者
- Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japanの論文著者
関連著者
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Zaima Shigeaki
Graduate School Of Eng. Nagoya Univ.
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Nakatsuka Osamu
Graduate School Of Engineering Nagoya University
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Nakatsuka Osamu
Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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Nakatsuka Osamu
Graduate School of Eng., Nagoya Univ.
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Zaima Shigeaki
Graduate School of Engineering, Nagoya University, Nagoya 464-8603, Japan
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SAKAI Akira
Graduate School of Engineering, Nagoya University
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Nakamura Tomoji
Fujitsu Lab. Ltd.
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Kim Youngsuk
School Of Mechanical Engineering Kyungpook National University
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Izunome Koji
Covalent Materials Corporation, 6-861-5 Higashi-ko, Seiro, Kitakanbara, Niigata 957-0197, Japan
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Isogai Hiromichi
Covalent Materials Corporation, Seiro, Niigata 957-0197, Japan
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Toyoda Eiji
Covalent Silicon Co., Ltd., Seiro, Niigata 957-0197, Japan
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Senda Takeshi
Covalent Materials Corporation, Seiro, Niigata 957-0197, Japan
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Omote Kazuhiko
Rigaku Corp., Akishima, Tokyo 196-8666, Japan
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Ohba Takayuki
School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Kitada Hideki
School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Mizushima Yoriko
Fujitsu Laboratories Ltd., Atsugi, Kanagawa 243-0197, Japan
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Toyoda Eiji
Covalent Materials Corporation, Seiro, Niigata 957-0197, Japan
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Sakai Akira
Graduate School of Engineering Science, Osaka University, 1-3 Machikaneyama-cho, Toyonaka, Osaka 560-8531, Japan
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Mizushima Yoriko
Fujitsu Laboratories Ltd., Akiruno Technology Center, 50 Fuchigami, Akiruno, Tokyo 197-0833, Japan
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Kim Youngsuk
School of Engineering, The University of Tokyo, Bunkyo, Tokyo 113-8656, Japan
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Sakai Akira
Graduate School of Engineering Science, Osaka University, 1-3 Machikane-cho, Toyonaka, Osaka 560-8531, Japan
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Senda Takeshi
Covalent Materials Corporation, 6-861-5 Higashi-ko, Seiro, Kitakanbara, Niigata 957-0197, Japan
著作論文
- Characterization and Analyses of Interface Structures in Directly Bonded Si(011)/Si(001) Substrates
- Characterization of Local Strain around Through-Silicon Via Interconnects by Using X-ray Microdiffraction