Flow Condition in Resist Spray Coating and Patterning Performance for Three-Dimensional Photolithography over Deep Structures
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概要
- 論文の詳細を見る
Spray coating of the photoresist is an attractive technique that offers new processes for realizing three-dimensional structures in a manner compatible with well-established planar photolithography. There are, however, many hurdles to overcome for its development, including the analysis of coating mechanism. Essentially, this is because the method used is the complex gas-liquid two-phase flow. In this paper, the detailed results relating to the resist film deposition inside microstructures of the Si wafer are described, while focusing on the pinhole distribution, which is a serious drawback of the application. In addition, the performance of the pattern transfer over deep (${>}1$ mm) structures is investigated using a projection-type aligner.
- 2004-04-15
著者
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Hane Kazuhiro
Department Of Electronic Mechanical Engineering Faculty Of Engineering Nagoya University
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Sasaki Minoru
Department Of Acoustic Design Kyushu Institute Of Design
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Esashi Masayoshi
New Industry Creation Hatchery Center (niche) Tohoku University
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Singh Vijay
Department of Mechatronics and Precision Engineering, Tohoku University, Aramaki 01, Aoba-ku, Sendai 980-8579, Japan
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