Heating Effect on Photoresist in Spray Coating Technique for Three-Dimensional Lithography
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概要
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Spray coating of the photoresist is a promising technique for realizing photolithography on three-dimensional structures, which is frequently desired in the field of microelectromechanical systems. Revealing the technical performance and determining the optimum conditions are indispensable for making the process reliable. The conditions required for obtaining a uniform resist thickness over the anisotropically wet etched deep cavity are examined. The sample temperature and the power density required for heating the sample are found to have a significant effect. At the optimized conditions, a uniform resist film is obtained over the cavity (with an average thickness of 1.5 μm on the top, slanting, and bottom flat regions, and 2.4 and 2.7 μm on the convex and concave corners, respectively).
- 2003-06-15
著者
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SINGH Vijay
Department of Nanomechanics Engineering, Tohoku University
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Hane Kazuhiro
Department Of Electronic Mechanical Engineering Faculty Of Engineering Nagoya University
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Sasaki Minoru
Department Of Acoustic Design Kyushu Institute Of Design
-
Song Jong
Department Of Anesthesiology And Pain Medicine Yonsei University College Of Medicine
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Singh Vijay
Department of Mechatronics and Precision Engineering, Tohoku University, Aramaki 01, Aoba-ku, Sendai 980-8579, Japan
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Song Jong
Department of Mechatronics and Precision Engineering, Tohoku University, Aramaki 01, Aoba-ku, Sendai 980-8579, Japan
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