Si-Wafer Bending Technique for a Three-Dimensional Microoptical Bench
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概要
- 論文の詳細を見る
We propose and demonstrate a Si-wafer bending technique for preparing a three-dimensional microoptical bench (MOB). The process for preparing the three-dimensional MOB is based on the usual planar photolithography, anisotropic wet etching and preparation of the photoresist V-groove joint. The bending angle is controlled by the jig on which the wafer is fixed. This jig is prepared separately by the usual machining. The measured accuracy of the bending angle is within $\pm 0.2$°. The advantage of this method is that an arbitrary bending angle can be set by changing the jig without the restriction of micromachining. This is a combination of the usual machining technique and the micromachining technique which realizes a three-dimensional microstructure. This simple and flexible bending technique can yield three-dimensional MOBs on which optical elements can be aligned by chip bonding or by preparing an alignment guide.
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-06-15
著者
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SONG JongHyeong
Department of Mechatronics and Precision Engineering, Tohoku University
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Hane Kazuhiro
Department Of Electronic Mechanical Engineering Faculty Of Engineering Nagoya University
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ISHIMORI Masahiro
Department of Mechatronics and Precision Engineering, Tohoku University
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Sasaki Minoru
Department Of Acoustic Design Kyushu Institute Of Design
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Hane Kazuhiro
Department of Mechatronics and Precision Engineering, Tohoku University, Aoba-01, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Sasaki Minoru
Department of Mechatronics and Precision Engineering, Tohoku University, Aoba-01, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Song JongHyeong
Department of Mechatronics and Precision Engineering, Tohoku University, Aoba-01, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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Ishimori Masahiro
Department of Mechatronics and Precision Engineering, Tohoku University, Aoba-01, Aramaki, Aoba-ku, Sendai 980-8579, Japan
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