Physical Random-Number Generator Using Schottky MOSFET
スポンサーリンク
概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2002-04-30
著者
-
Asano Tanemasa
Center For Microelectronic Systems Kyushu Institute Of Technology
-
Nakagawa Gou
Center For Microelectronic Systems Kyushu Institute Of Technology
-
Maeda Y
Deparment Of Information And Control Engineering Toyota Technological Institute
-
ARIMA Yutaka
Center for Microelectronic Systems, Kyushu Institute of Technology
-
Maeda Y
Center For Microelectronic Systems Kyushu Institute Of Technology
-
Arima Yutaka
Department Of Neural Amp Parallel Processing Technology Advanced Technology Rampd Center Mitsubishi
-
Arima Yutaka
Center For Microelectronic System Kyushu Institute Of Technology
-
MAEDA Yasuhiro
Center for Microelectronic Systems, Kyushu Institute of Technology
-
Maeda Yukio
Department Of Applied Physics Tokyo University Of Agriculture And Technology
関連論文
- Synthesis of A15 Nb-Si Films on Si-Precoated Substrate Using Dual-Target Sputtering
- Dynamics of Rapid Phase Transformations in Amorphous GeTe Induced by Nanosecond Laser Pulses : Media
- Dynamics of Rapid Phase Transformations in Amorphous GeTe Induced by Nanosecond Laser Pulses
- Microstructural Analysis of CoCr Thin Films by Small-Angle Neutron Scattering
- Imaging of the DNA (deoxyribonucleic acid) Double Helix Structure by Noncontact Atomic Force Microscopy
- Adsorption Structure of Copper-Phthalocyanine Molecules on a Si(100)2×1 Surface Observed by Scanning Tunneling Microscopy
- Ion Beam Modification of a Photoresist and Its Application to Field Emitters
- Field Emission from an Jon Irradiated Photoresist
- D315 A NOVEL FLUIDIC MICROMOTOR DRIVEN BY THERMOCAPILLARY FORCE(Micro-scale phenomena)
- A Variable Channel-Size MOSFET with Lightly Doped Drain Structure
- SOI-MOSFET/Diode Composite Photodetection Device
- Electrostatic Inkjet Patterning Using Si Needle Prepared by Anodization
- Electrostatic Droplet Ejection Using Planar Needle Inkjet Head
- Fabrication of Micro Field Emitter Tip Using Ion-Beam Irradiation-Induced Self-Standing of Thin Films
- Field Electron Emission from Inkjet-Printed Carbon Black
- Increased Emission Efficiency of Gated Cold Cathode with Carbonic Nano-Pillars
- Micro Field Emitter with Nano-Pillarets Formed by Reactive Ion Etching of Photoresist
- Suppressing Plasma Induced Degradation of Gate Oxide Using Silicon-on-Insulator Structures
- Suppressing Plasma Induced Degradation of Gate Oxide by Using Silicon-On-Insulator Structures
- Reduction of Charge Build-up during Reactive Ion Etching by Using SOI Structures
- Variation of Photoluminescence Properties of Stain-Etched Si with Crystallinity of Starting Polycrystalline Si Films
- Accurate Determination of the Urbach Energy of a-Si:H Thin Films by Correction for the Interference Effect
- In Situ Optical Measurement Using Optical Fibers for a-Si:H Ultra-Thin Films: Theoretical and Numerical Analysis
- Ion Beam Modified Photoresist : A New Class of Field Emitter Material for Large Area Devices (Special Issue on Electronic Displays)
- Connection Test of Area Bump Using Active-Matrix Switches
- Connection Test of Area Bump Using Active-Matrix Switches
- Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
- Dynamic Strain and Its Distribution during Ultrasonic Flip Chip Bonding
- CMOS Application of Single-Grain Thin Film Transistor Produced Using Metal Imprint Technology
- Low-Voltage-Signaling CMOS Receiver with Dynamic Threshold Control
- Low-Voltage-Signaling CMOS Receiver with Dynamic Threshold Control
- All-Optical Inverter Operating up to 850℃ in an Erbium-Doped Phosphate Glass
- Temperature Dependence of Negative Nonlinear Absorption Effect in an Erbium-doped Borate Glass
- All-Optical Inverter Operating with a 1.5 μm Laser in Erbium-Doped Phosphate Glass
- Bias Effect on Compositional Separation in Sputtered Co-Cr Films
- Optimization of Transparent Conductive Oxide for Improved Resistance to Reactive and/or High Temperature Optoelectronic Device Processing
- NMR Study of Magnetic and Compositional Inhomogeneities in Co-Cr Thin Films
- Control of Orientation for Polycrystalline Silicon Thin Films Fabricated from Fluorinated Source Gas by Microwave Plasma Enhanced Chemical Vapor Deposition
- Joule Heating of Field Emitter Tip Fabricated on Glass Substrate
- Influence of Direct Au-Bump Formation on Metal Oxide Semiconductor Field Effect Transistor
- Behavior of Plated Microbumps during Ultrasonic Flip-Chip Bounding Determined from Dynamic Strain Measurement
- Effects of Electric Field on Metal-Induced Lateral Crystallization under Limited Ni-Supply Condition(Thin Film Transistors, Fundamental and Application of Advanced Semiconductor Devices)
- Physical Random-Number Generator Using Schottky MOSFET
- Physical Random-Number Generator Using Schottky MOSFET
- Breakdown Voltage in Uniaxially Strained n-Channel SOI MOSFET
- Schottky Source/Drain SOI MOSFET with Shallow Doped Extension
- Monitoring of Two-Dimensional Plasma Uniformity with Electrostatic Probing of Oxidized Wafer Surface : Semiconductors
- Imprint Lithography Using Triple-Layer-Resist and Its Application to Metal-Oxide-Silicon Field-Effect-Transisor Fabrication
- Fabrication of Single-Crystal Silicon Field Emitter Array on Glass Substrate
- Measurement of Dynamic Strain during Ultrasonic Au Bump Formation on Si Chip
- New SOI Complementary-Bipolar Complementary-MOS(CBiCMOS)with Merged Device Structure
- A New Merged Bipolar-MOS Transistor in a Silicon on Insulator Structure
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Microheater-Driven Dancing Microbubble
- Easy Release of Mold in Imprint Lithography Using Ion-Beam-Irradiated Photoresist Surface
- Fabrication of Carbon-Based Field Emitters Using Stamp Technology
- A New Merged BiMOS Transistor in an SOI Structure
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Enhanced Solid-Phase Crystallization of Amorphous Si by Plasma Treatment Using Reactive Ion Etching
- Selective Solid-Phase Crystallization of Amorphous Si by Oxygen Plasma Treatment
- Control of Si Solid Phase Nucleation by Surface Steps for High-Performance Thin-Film Transistors
- Si Field Emitter Arrays Fabricated by Anodization and Transfer Technique
- Gas Species Dependent Charge Build-Up in Reactive Ion Etching
- Synthesis and Electrical Properties of Phosphorus-Doped Homoepitaxial Diamond (111) by Microwave Plasma-Assisted Chemical Vapor Deposition Using Triethylphosphine as a Dopant Source
- Reduction of Charge Build-Up during Reactive Ion Etching by Using Silicon-On-Insulator Structures
- Reduction of the Floating Body Effect in SOI MOSFETs by Using Schottky Source/Drain Contacts
- Fabrication of Field Emitter Arrays Using Si Delamination by Hydrogen Ion Implantation
- Fabrication of Microcantilever with a Silicon Tip Prepared by Anodization
- Field Emission from an Ion-Beam-Modified Polyimide Film
- A New Self-Aligned Process for Fabrication of Microemiter Arrays Using Selective Etching of Silicon
- Fabrication of Single-Crystal Si Microstructures by Anodization
- CMOS Image Sensor Using SOI-MOS/Photodiode Composite Photodetector Device
- Influence on Electrical Characteristic of Direct Au-Bumping on MOSFET
- Wafer-level Fabrication of Compliant Bump
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Measurement of Dynamic Strain during Ultrasonic Au-Bumping on Si Chip
- Application of Microwave Plasma Gate Oxidation to Strained-Si on SiGe and SGOI
- SOI-MOS/Diode Composite Photodetector Device
- New SOI-CBiCMOS with Merged Device Structure
- Reduction of the Floating-Body Effect in SOI MOSFETs by Using Schottky Source/Drain Contacts
- Characteristics of Thin-Film Transistors Fabricated on Nucleation-Controlled Poly-Si Films by Surface Steps
- Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
- Electrostatic Inkjet Patterning Using Si Needle Prepared by Anodization
- Electrostatic Droplet Ejection Using Planar Needle Inkjet Head
- Field Electron Emission from Inkjet-Printed Carbon Black
- Connection Test of Area Bump Using Active-Matrix Switches
- Low-Voltage-Signaling CMOS Receiver with Dynamic Threshold Control
- A Variable Channel-Size MOSFET with Lightly Doped Drain Structure
- CMOS Application of Single-Grain Thin Film Transistor Produced Using Metal Imprint Technology
- SOI-MOSFET/Diode Composite Photodetection Device
- Location and Orientation Control of Si Grain by Combining Metal-Induced Lateral Crystallization and Excimer Laser Annealing
- Breakdown Voltage in Uniaxially Strained n-Channel SOI MOSFET
- Cross-Hatch Related Oxidation and Its Impact on Performance of Strained-Si MOSFETs
- CMOS Application of Schottky Source/Drain SOI MOSFET with Shallow Doped Extension
- Fabrication of a Gated Cold Cathode Using the Inkjet Embedding Method
- Micro Field Emitter with Nano-Pillarets Formed by Reactive Ion Etching of Photoresist
- Behavior of Plated Microbumps during Ultrasonic Flip-Chip Bonding Determined from Dynamic Strain Measurement
- Increased Emission Efficiency of Gated Cold Cathode with Carbonic Nano-Pillars
- Schottky Source/Drain SOI MOSFET with Shallow Doped Extension
- Location Control of Si Thin-Film Grain Using Ni Imprint and Excimer Laser Annealing