Measurement of Dynamic Strain during Ultrasonic Au-Bumping on Si Chip
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概要
- 論文の詳細を見る
- 1999-09-20
著者
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Asano Tanemasa
Center For Microelectronic Systems Kyushu Institute Of Technology
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Hizukuri Masafumi
Center For Microelectronic Systems Kyushu Institute Of Technology
関連論文
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