Dynamic Strain and Its Distribution during Ultrasonic Flip Chip Bonding
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概要
- 論文の詳細を見る
- 2000-08-28
著者
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Asano T
Kyushu Inst. Technol. Fukuoka Jpn
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Asano Tanemasa
Center For Microelectronic Systems Kyushu Institute Of Technology
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Watanabe Naoya
Center For Microelectronic Systems Kyushu Institute Of Technology
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HIZUKURI Masafumi
Center for Microelectronic Systems, Kyushu Institute of Technology
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Hizukuri Masafumi
Center For Microelectronic Systems Kyushu Institute Of Technology
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