Watanabe Naoya | Center For Microelectronic Systems Kyushu Institute Of Technology
スポンサーリンク
概要
関連著者
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Asano Tanemasa
Center For Microelectronic Systems Kyushu Institute Of Technology
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Watanabe Naoya
Center For Microelectronic Systems Kyushu Institute Of Technology
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Asano Tanemasa
Kyushu Inst. Of Technol. Fukuoka Jpn
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HASEGAWA Satoshi
Center for Interdisciplinary Research, Tohoku University
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Asano T
Kyushu Inst. Technol. Fukuoka Jpn
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HIZUKURI Masafumi
Center for Microelectronic Systems, Kyushu Institute of Technology
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Hizukuri Masafumi
Center For Microelectronic Systems Kyushu Institute Of Technology
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MAEDA Yasuhiro
Center for Microelectronic Systems, Kyushu Institute of Technology
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OOTANI Youhei
Center for Microelectronic Systems, Kyushu Institute of Technology
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Hasegawa Satoshi
Center For Interdisciplinary Research Tohoku University
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Ootani Youhei
Center for Microelectronic Systems, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
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Asano Tanemasa
Center Of Microelectronic Systems Kyushu Institute Of Technology
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Maeda Y
Center For Microelectronic Systems Kyushu Institute Of Technology
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Watanabe Naoya
Center Of Microelectronic Systems Kyushu Institute Of Technology
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KOJIMA Takeaki
Center for Microelectronic Systems, Kyushu Institute of Technology
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NISHISAKA Mika
Center for Microelectronic Systems, Kyushu Institute of Technology
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Kojima Takeaki
Center For Microelectronic Systems Kyushu Institute Of Technology
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Nishisaka Mika
Center For Microelectronic Systems Kyushu Institute Of Technology
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Hasegawa Satoshi
Center For Microelectronic Systems Kyushu Institute Of Technology
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Hizukuri Masafumi
Center for Microelectronic Systems, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
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Nishisaka Mika
Center for Microelectronic Systems, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
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Watanabe Naoya
Center for Microelectronic Systems, Kyushu Institute of Technology
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Kojima Takeaki
Center for Microelectronic Systems, Kyushu Institute of Technology, 680-4 Kawazu, Iizuka, Fukuoka 820-8502, Japan
著作論文
- Connection Test of Area Bump Using Active-Matrix Switches
- Connection Test of Area Bump Using Active-Matrix Switches
- Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
- Dynamic Strain and Its Distribution during Ultrasonic Flip Chip Bonding
- Influence of Direct Au-Bump Formation on Metal Oxide Semiconductor Field Effect Transistor
- Behavior of Plated Microbumps during Ultrasonic Flip-Chip Bounding Determined from Dynamic Strain Measurement
- Breakdown Voltage in Uniaxially Strained n-Channel SOI MOSFET
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Influence on Electrical Characteristic of Direct Au-Bumping on MOSFET
- Wafer-level Fabrication of Compliant Bump
- Pyramid Bumps for Fine-Pitch Chip-Stack Interconnection
- Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
- Connection Test of Area Bump Using Active-Matrix Switches
- Breakdown Voltage in Uniaxially Strained n-Channel SOI MOSFET
- Behavior of Plated Microbumps during Ultrasonic Flip-Chip Bonding Determined from Dynamic Strain Measurement