Influence on Electrical Characteristic of Direct Au-Bumping on MOSFET
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概要
- 論文の詳細を見る
- 2001-09-25
著者
-
Asano Tanemasa
Center For Microelectronic Systems Kyushu Institute Of Technology
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Watanabe Naoya
Center For Microelectronic Systems Kyushu Institute Of Technology
関連論文
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- Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
- Electrostatic Inkjet Patterning Using Si Needle Prepared by Anodization
- Electrostatic Droplet Ejection Using Planar Needle Inkjet Head
- Field Electron Emission from Inkjet-Printed Carbon Black
- Connection Test of Area Bump Using Active-Matrix Switches
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- A Variable Channel-Size MOSFET with Lightly Doped Drain Structure
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