Behavior of Plated Microbumps during Ultrasonic Flip-Chip Bounding Determined from Dynamic Strain Measurement
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-04-30
著者
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Asano Tanemasa
Center For Microelectronic Systems Kyushu Institute Of Technology
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Watanabe Naoya
Center For Microelectronic Systems Kyushu Institute Of Technology
-
Asano Tanemasa
Center Of Microelectronic Systems Kyushu Institute Of Technology
-
Watanabe Naoya
Center Of Microelectronic Systems Kyushu Institute Of Technology
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