Ti超塑性合金を用いたマイクロ金型の製造技術

概要

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We have developed a fabrication technique of micro-dies made of titanium super plastic alloy. Shapes of micro silicon structures, which are formed on a silicon substrate by micromachining technique, were imprinted to titanium super plastic alloy using a vacuum press machine at a temperature of 720 °C. We investigated the method to flatten the sidewall of dry-etched silicon structures, and obtained the surface roughness of less than 10 nm. A graded layer of TiN/Ti film, which is deposited on the silicon microstructures by sputtering, was also examined to prevent titanium diffusion into the silicon microstructures during the high temperature pressing. Using the developed technique, a concave titanium super plastic alloy mold for an optical wave-guide was successfully produced, exhibiting filling factor of 99.58%.
社団法人電気学会の論文
2004-04-01