2839 単結晶シリコン薄膜の破壊靱性に及ぼす寸法と環境温度の効果(S08-3 微小機械設計・開発のための実験力学の新展開(3),S08 微小機械設計・開発のための実験力学の新展開)

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This paper reports a transition of fracture behavior of micron-sized single-crystal silicon (SCS) in MEMS structure. We evaluated the fracture toughness of two types of SCS films, which has 1- and 4-μm thickness, at the temperatures ranging from RT to 500℃ by tensile test. The fracture toughness of 4-μm thick specimen at RT was 1.28MPa-√<m>, which remained at a similar value up to 60℃. However, it increased drastically at 70℃ and stood at 2.60GPa√<m> at 150℃. The fracture behavior of 4-μm thick SCS film clearly changed at 70℃. On the other hand, the fracture toughness of 1-μm thick specimens was showed high toughness value of 2.70MPa√<m> even at RT. The results show the fracture toughness of SCS film was influenced by environmental temperature and its thickness.
社団法人日本機械学会の論文
2007-09-07