430 単結晶シリコン薄膜の破壊靱性値 : 温度および方位依存性(T09-2 微小機械システムにおけるマイクロ・ナノ力学(2) 単結晶シリコンの力学特性,大会テーマセッション,21世紀地球環境革命の機械工学:人・マイクロナノ・エネルギー・環境)

概要

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This paper reports effects of temperature and crystal orientation on fracture toughness of single-crystal silicon (SCS) thin films. We evaluated the fracture toughness of (110) SCS thin film, which has V-shaped notch with <110> tensile direction, at the temperatures ranging from RT to 300 ℃ by using "on-tip" tensile test. The fracture toughness of (110) specimen was higher than that of (100), however, showed steep increase between RT and 80 ℃ in the same manner. Moreover, the fracture behavior like crack propagation changed over 80 ℃. It was found that Brittle-to-Ductile Transition (BDT) temperature of 4 gm thick silicon was around 80 ℃ and was not effected by crystal orientation.
社団法人日本機械学会の論文
2008-08-02