薄膜材料を対象とするオンチップ引張疲労試験システムの開発

概要

論文の詳細を見る
Fatigue test of single-crystal-silicon thin films under uniaxial tensile condition was performed on a silicon chip. In this on-chip tensile testing method, tensile testing specimen integrated with loading mechanisms on a same silicon chip was used for the characterization of mechanical property.A newly introduced testing machine allowed experiments under both quasi-static and dynamic loading conditions. An external loading actuator pushing the testing chip precisely traveled in horizontal direction owing to air bearing support and linear DC servomotor. The displacement of the actuator was detected with a sensor having a resolution of 0.1 μm, and applied load was measured by a load cell with a resolution of 1 mN. Measurement accuracy was 'proved by perfoming quasi-static tensile test of single-crystal-silicon whose tensile axis was oriented in a <100> direction. Sinusoidal cyclic.load was applied to the testing chip with the maximum strain of 3.9 % and the frequency of 10 Hz. Fatigue failure was observed as a decrease in the detected force, while the applied displacement didn't change.
社団法人精密工学会の論文
2000-12-05