2831 薄膜の曲げ試験用デバイスの開発(S08-2 微小機械設計・開発のための実験力学の新展開(2),S08 微小機械設計・開発のための実験力学の新展開)

概要

論文の詳細を見る
We developed a novel type of bending testing device to study the mechanical properties of structural thin films commonly used in MEMS devices at the temperature from room temperature to 100℃. Tests were carried out by out-of-plane bending of cantilever specimens with two-step width, in which the stress concentration point shifted to inside corner of the width step from the fixed end. In this test, no variation of bending strength between two temperatures was observed from the measured load and displacement graphs and SEM photograph of the fractured specimen. Fracture started at the area close to the stress concentration and propagated in an oblique direction through the thickness occurred in the high stress concentrated area of narrow width portion.
社団法人日本機械学会の論文
2007-09-07