A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
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概要
- 論文の詳細を見る
- Published by the Japan Society of Applied Physics through the Institute of Pure and Applied Physicsの論文
- 2003-10-15
著者
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Kim Yong
Semiconductor Materials and Devices Lab, Korea Institute of Science and Technology
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Kim Y
Semiconductor Materials And Devices Laboratory Korea Institute Of Science And Technology
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Kim Seong-il
Semiconductor Devices Laboratory Korea Institute Of Science And Technology
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Sim H
Korea Inst. Of Sci. And Technol. Seoul Kor
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JEON Hyeongtag
Division of Materials Science and Engineering, Hanyang University
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SIM Hyun
Semiconductor Materials and Devices Lab., Korea Institute of Science and Technology
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Kim S
Semiconductor Devices Laboratory Korea Institute Of Science And Technology
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