TiN Diffusion Barrier Grown by Atomic Layer Deposition Method for Cu Metallizaiton
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概要
- 論文の詳細を見る
- 2001-07-15
著者
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JEON Hyeongtag
Division of Materials Science and Engineering, Hanyang University
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Jeon Hyeongtag
Division Of Materials Science And Engineering Hanyang University
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Jeon Hyeongtag
Division Of Materials Science & Engineering Hanyang University
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Uhm Jangwoong
Division of Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea
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Uhm Jangwoong
Division Of Materials Science And Engineering Hanyang University
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