Low-Temperature Growth of Carbon Nanotube by Plasma-Enhanced Chemical Vapor Deposition using Nickel Catalyst
スポンサーリンク
概要
- 論文の詳細を見る
Carbon nanotubes (CNTs) were grown on silicon (Si) substrates with a native oxide layer using a nickel (Ni) catalyst by the plasma-enhanced chemical vapor deposition method at 550 and 650°C. Multiwall CNTs with a large inside hollow core were observed with samples deposited on Si substrates with a native oxide layer. However, no CNT growth was observed with samples deposited on Si substrates without a native oxide layer due to the formation of Ni-silicide. The native oxide layer was believed to act as the diffusion barrier and to suppress the formation of Ni-silicide. The typical diameter and length of CNTs ranged from about 30 to 100 nm and 2 to 3 μm, respectively. The size of CNTs was more strongly dependent on the thickness of the Ni layer than on the growth temperature. The surface roughness and amount of surface defects decreased with increasing process temperature. We performed a post hydrogen plasma treatment for the purification of raw CNTs. The post hydrogen plasma treatment successfully removed residual graphite particles and/or metallic impurities without significant damage to the CNTs.
- 2003-06-15
著者
-
Kim Yangdo
School Of Materials Science And Engineering Pusan National University
-
RYU Kyoungmin
Division of Materials Science and Engineering, Hanyang University
-
KANG Mihyun
Division of Materials Science and Engineering, Hanyang University
-
Jeon Hyeongtag
Division Of Materials Science & Engineering Hanyang University
-
Ryu Kyoungmin
Division of Materials Science and Engineering, Hanyang University, Seoul 133-791, Korea
関連論文
- Compositional Variations of TiAlN Films Deposited by Metalorganic Atomic Layer Deposition Method
- Comparison of Co Films Deposited by Remote Plasma Atomic Layer Deposition Method with Cyclopentadienylcobalt Dicarbonyl [CpCo(CO)_2] and Dicobalt Octacarbonyl [Co_2(CO)_8]
- ZrO_2 Gate Dielectric Deposited by Plasma-Enhanced Atomic Layer Deposition Method
- TiN Diffusion Barrier Grown by Atomic Layer Deposition Method for Cu Metallizaiton
- A study of the incorporation of conducting materials into direct-patternable SnO2 thin films formed by photochemical metal-organic deposition
- Effects of NH_3 Plasma Treatment on Methyl Silsequioxane for Copper Multi-Level Interconnect(Semiconductors)
- Field-Emission Activation on Boron-Doped Chemical-Vapor-Deposited Polycrystalline Diamond Films
- Study of the electrical enhancement of direct-patternable Ag-nanostructures embedded SnO_2 thin films prepared by photochemical metal-organic deposition
- Low-Temperature Growth of Carbon Nanotube by Plasma-Enhanced Chemical Vapor Deposition using Nickel Catalyst
- Surface Characteristics of Indium-Tin Oxide Cleaned by Remote Plasma
- Removal of the Polymer Formed at Via Hole with Via Etching Stopped on an Al layer Structure
- Low-Temperature Growth of Carbon Nanotube by Plasma-Enhanced Chemical Vapor Deposition using Nickel Catalyst
- Barrier Characteristics of ZrN Films Deposited by Remote Plasma-Enhanced Atomic Layer Deposition Using Tetrakis(diethylamino)zirconium Precursor
- A Comparison of Al2O3/HfO2 and Al2O3/ZrO2 Bilayers Deposited by the Atomic Layer Deposition Method for Potential Gate Dielectric Applications
- A New Pulse Plasma Enhanced Atomic Layer Deposition of Tungsten Nitride Diffusion Barrier for Copper Interconnect
- Microstructure Effect on the High-Temperature Oxidation Resistance of Ti–Si–N Coating Layers
- Effects of Strained Silicon Layer on Nickel (Germano)silicide for Nanoscale Complementary Metal Oxide Semiconductor Field-Effect Transistor Device
- Study of Nickel Silicide Thermal Stability Using Silicon-on-Insulator Substrate for Nanoscale Complementary Metal Oxide Semiconductor Field-Effect Transisor Device
- Comparison of TiN Films Deposited Using Tetrakisdimethylaminotitanium and Tetrakisdiethylaminotitanium by the Atomic Layer Deposition Method
- Fabrication and Characterization of Direct-Patternable ZnO Films Containing Pt Nanoparticles
- Metal Oxide Semiconductor Field Effect Transistor Characteristics with Iridium Gate Electrode on Atomic Layer Deposited ZrO2 High-$k$ Dielectrics
- Characteristics of Cobalt Films Deposited by Metal Organic Chemical Vapor Deposition Method Using Dicobalt Hexacarbonyl tert-Butylacetylene
- Reduction of RuO
- Characteristics of Polymer Residues Formed at the Via Hole and Photoresist Ashing Properties of Remote Oxygen/Nitrogen Plasma
- Reduction of RuO₂ Film to Metallic Ru Film Using Atomic Layer Deposition under Different Oxygen Partial Pressure (Special Issue : Advanced Metallization for ULSI Applications)
- Moisture Barrier Properties of Al₂O₃ Films deposited by Remote Plasma Atomic Layer Deposition at Low Temperatures