Brazing of Si_3N_4 to Metals with Al-Cu Filler Metals(Physics, Process, Instrument & Measurement)
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概要
- 論文の詳細を見る
The sessile drop technique has been used to measure the contact angle of Al-Cu alloys on Si_3N_4 in a vacuum, and evaluate the work of adhesion of the alloys as a measure of adhesion intensity. The work of adhesion for Al-Cu alloys on Si_3N_4 at 1373K departs to the plus side from the ideal mixing of aluminum and copper at the copper content below 50 at%, and exhibits the maximum of 1.42 Jm^<-2> for 4 mass% Cu. The wettability of aluminum on Si_3N_4 is improved by mixing of aluminum and copper at aluminum rich alloys. The brazing of Si3_N_4 to metal was performed using Al-4 mass% Cu filler where metal is Ti, Nb, Ni or SUS304. The superior work of adhesion and mechanical property of the Al-Cu filler provide the superior strength of Si_3N_4/metal joint.
- 大阪大学の論文
著者
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Okamoto Ikuo
Osaka University
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NAKA Masaaki
Osaka University
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Okamoto Ikuo
Welding Research Institute Of Osaka University
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Naka M
Osaka University
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KUBO Masao
Osaka University
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Kubo M
Osaka University:(present Office)matsushita Denko Co. Ltd.
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