Effect of Sn Addition to Cu-Ti Filler Metals on Microstructure and Strength of SiC/SiC Joint(Materials, Metallurgy & Weldability)
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概要
- 論文の詳細を見る
SiC was brazed to SiC in vacuum using two series of Cu-16.5 at%Sn-X at%Ti and Cu-X at%Sn-21 at%Ti alloys. At a constant Sn content of 16.5 at% the strength of the SiC/SiC joint shows a maximum at 5.6 at%Ti , and decreases with the further content of Ti in the alloys. Two factors operates to yield the maximum strength of the SiC/SiC joint. The fine Ti_5Si_3 precipitates distribute densely at the SiC/the alloy interface, and α-Cu solid solution containing Sn and δ-Cu-Sn intermetallic yield a two phase eutectoid structure. The excess amounts of Sn and Ti in the alloys form a brittle intermetallic of CuSn_3Ti_5 in the joining layer of SiC/SiC, and affect the strength of the joint.
- 大阪大学の論文
著者
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NAKA Masaaki
Osaka University
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Urai S
Toyama National Coll. Technol.
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Urai Shigeo
Osaka University:toyama National College Of Technology
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