Wetting of Silicon Nitride by Copper-Titanium or Copper-Zirconium Alloys(Welding Physics, Process & Instrument)

概要

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The sessile drop technique has been used to measure the contact angle of molten copper-0-60 at% titanium or copper-0-60 at% zirconium alloys with Si_3N_4 as a function of time and temperature over the range 900°to 1100℃ using time-lapse photography in vacuum condition. The temperature dependence of contact angle of copper alloys containing 30 at% titanium or more is large although the dependence of alloys containing 20 at% titanium is small. The drops of containing 30 at% titanium or more largely spread. Since the time dependence of contact angle of alloys containing 30 at% titanium is quite large, the alloys show photographically small time dependence of the contact angle. On the other hand, the contact angle of Cu-20 at% Ti alloy changes from 40°to 10°after 120 min holding at 1100℃. At 1100℃ for 30 min the contact angles of alloys containing 30 at% or more titanium show the small value of 8°, This is attributable to the formation of intermediate layer mainly composed of TiN in thickness of 10μm or more. The Cu-Ti alloys are applicable to the filler metal for joining of Si_3N_4. The contact angle of copper-zirconium alloys at 1100℃ for 30 or 60 min decreases extremely at zirconium content of 30 at% or more. This is attributable to the formation of ZrN at the interface between Cu-Zr drops and Si_3N_4. The copper-zirconium alloys is, however, not applicable to the filler metal for joining of Si_3N_4.
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