Solid State Diffusion Bonding of Silicon Nitride with Vanadium Foils(Materials, Metallurgy & Weldability)

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This paper describes the relation between the interfacial microstructure and the fracture strength of joints of silicon nitride (Si_3N_4) and vanadium (V) formed by solid state diffusion bonding. At first, the interfacial microstructure and its evolution process were analyzed in detail. The phase sequence at the interface changes with the bonding time showing five typical stages, including a metastable state in the first stage of the interfacial reaction. V_3Si, V_2N, V_5Si_3N_<1-x> and VN are formed V_2N is formed in contact with V_3Si at 1473K and below, while the contact is prohibited at 1498K and above. The evolution process of the interfacial microstructure is successfully described on a chemical potential diagram with continuous and monotonously changing curves, except for the metastable first stage. The growth behaviors of each reaction product interact with each other. The behavior of the V_3Si layer is affected not only by the formation and growth of the V_5Si_3N_<1-x> layer but also by the formation of a V(Si) zone at the V_3Si/V interface. The formation of the V_5Si_3N_<1-x> layer starts when the spatial gradient of the chemical potential of vanadium in the V_3Si layer decreases to -3.3×10^9 Jmol^<-1>. The fracture strength of the joints changes depending on the bonding temperature and time. A higher bonding temperature leads to a higher maximum fracture strength. The maximum strength at each bonding temperature is achieved when the thickness of the V_3Si layer is 2.0μm. A prolonged bonding time gradually reduces the fracture strength down to 42MPa.
大阪大学の論文

Solid State Diffusion Bonding of Silicon Nitride with Vanadium Foils(Materials, Metallurgy & Weldability)

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