Wetting of Silicon Carbide by Copper-Titanium Alloys(Physics, Process, Instrument & Measurement)
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概要
- 論文の詳細を見る
The contact angle of molten Cu-Ti alloys containing Ti content up to 60 at% or more on SiC was investigated by a sessile drop technipue at 1373K in a vacuum. The contact angle of molten Cu-Ti alloys reaches the equilibrium value at 3.6ks at 1373K. The equilibrium contact angle of Cu-Ti alloys on SiC reduces drastically with increasing Ti content. Cu-Ti alloys containing Ti content of 30 at% or more shows the equilibrium contact angle of 7 degree or below. The addition of Ti to copper depresses the reaction of Cu with SiC by forming TiC and Ti_3 SiC_2 carbides at SiC/Cu-Ti interface. This accounts for the superior wetting of the Cu-Ti alloys on SiC. The Cu-Ti alloys are applicable to the filler for joining SiC.
- 大阪大学の論文
著者
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Naka M
Osaka Univ. Osaka Jpn
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Nishino Toshitsugu
Toyama College of Technology
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Urai Shigeo
Toyama College of Technology
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Okamoto Ikuo
Osaka University
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Naka Masaaki
Welding Research Institute, Osaka University
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NAKA Masaaki
Osaka University
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NISHINO Toshitugu
Department of Metallurgical Engineering, Toyama National College of Technology
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URAI Shigeo
Department of Metallurgical Engineering, Toyama National College of Technology
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Naka Masaaki
Welding Research Institute Osaka University
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