Joining of Silicon Nitride to Metals or Alloys Using Amorphous Cu-Ti Filler Metal(Materials, Metallurgy & Weldability)

概要

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Silicon nitride has been joined with various metals and alloys using amorphous Cu_<50>Ti_<50> filler alloy. The amorphous filler alloy in width of about 1cm and thickness of about 45μm was produced by rapid quenching of the liquid alloy. Under vacuum condition at 1000℃ for 5min Si_3N_4 was joined with iron or copper, and super inver, inver, kovar or SUS 304 alloy. During brazing, Ti in Cu-Ti filler reacts with Si_3N_4 and Fe, Cu or Co dissolves from metal or alloy to the filler. In the case of joining with copper large amounts of copper dissolve into the filler and the titanium in the filler diffuses into copper. The joining strength of Si_3N_4 with metal or alloy decreases with an increase in the thermal expansion coefficient or the product of thermal expansion coefficient and elastic modulus of metal and alloy. The thermal stress that arises from the difference of thermal expansion coefficoent of ceramic and metal or alloy affects the joining strength of ceramic and metal. In particular, the tension stress in the perpendicular direction to the joining interface takes place at the tension-tension stress region in the ceramic near the edge of metal or alloy.
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