Stress Corrosion Cracking Mechanism of Cu-4% Ti Alloy(Welding Mechanics, Strength & Design)
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概要
- 論文の詳細を見る
Stress corrosion cracking (SCC) mechanism of an aged Cu-4% Ti alloy has been investigated with respect to the effect of modulated structure on dissolution reactions. SCC tests were carried out in 6N aqueous ammonia containing 10.2/l copper under the applied tensile load of 80% of 0.2% proof stress. The depth of cracks and the number of transgranular cracks were measured after various testing times. Both inter- and transgranular cracks were formed during SCC test, but the depth of intergranular cracks was larger than that of transgranular ones irrespective of aging condition and testing time. The mechanism of the influence of aging at 450℃ on transgranular cracking susceptibility has been also investigated in relations to corrosion reaction and modulated structure. The increase of concentration difference of zone complex within the modulated structure was found to be responsible to the increase of the number of transgranular cracks in definite periods of modulated structure. The increase of the ratio of cathode area to anode area increased the depth of cracks. The increase of cathode area enhanced the dissolution reaction that was considered to be a main SCC process of this system since the dissolution reaction of the alloy proceeded under concentration polarization and was controlled by cathodic reaction.
- 大阪大学の論文
著者
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Okamoto Ikuo
Osaka University
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TAKEMOTO Tadashi
Osaka University
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Hori Shigenori
Department Of Materials Science And Engineering Graduate Scool Of Engineering Osaka University
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Hori Shigenori
Department Of Meterials Science And Engiceering Faculty Of Engineering Osaka University
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