Spreading of Copper Phosphorus Brazing Filler Metals with Low Melting Temperature containing silver and/or Tin : Copper Phosphorus Brazing Filler Metals with Low Melting Temperature (Report IV)(Physics, Process, Instrument & Measurement)

概要

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Spreadability of copper phosphorus brazing filler metals with low melting temperature has been investigated on pure copper base metal. Spread tests were carried out between 650℃ and 715℃ in an air atmosphere without flux. Spread area of Cu-Sn-P filler metals were inferior to that of Cu-Ag-P filler metals, which is explained by the thermodynamic calculation that tin oxide is not so easily reduced by phosphorus compared with copper oxide. The spread area of Cu-Ag-Sn-P quaternary system filler metals were larger than Cu-Sn-P system at the same test temperature, however, the area was significantly smaller than in Cu-Ag-P ternary system. The fillet formation test in argon gas atmosphere revealed the good fillet was obtained in both Cu-Ag-P and tin bearing filler metals. Tin bearing filler metals showed better fillet appearance at lower brazing temperatures.
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